Quatech 802.11B/G Especificaciones descargar pdf (Pagina 33)

100-8004-102G Airborne Wireless LAN Node Module Data Book

Page 27

Quatech, Inc. Confidential

3.1 OVERVIEW

This chapter contains recommended layout practices. Topics covered in this chapter include:

 3.2 Module Mounting Guidelines (below)

 3.3 Circuit Board Layout Practices (below)

 3.4 EMI/RFI Guidelines (page 28)

3.2 MODULE MOUNTING GUIDELINES

Special care must be observed when placing the Airborne WLN Module. In particular:

 The antenna must not be mounted below any other printed circuit boards,

components, or metallic housing.

 The proximity of the antenna to large metallic objects can affect the Module’s range

and performance.

 Packaging and enclosure designers must carefully review the placement of the

Module in the enclosure and the placement of the antenna to minimize interference

or blocking sources.

 The mounting screw for the module is a Pan Head Torx Screw for Plastic Zinc-Plated

Steel, 0-42 Thread, 3/8" Length.

 For mechanical clearance, performance, and emissions reasons, there should be no

components placed on the main printed circuit board facing the Module. This region

should be clear of components, as indicated by the clear area in Figure 8 on the next

page.

3.3 CIRCUIT BOARD LAYOUT PRACTICES

When considering capacitance, calculations must take into account all device loads and

capacitance due to printed circuit board traces. Capacitance due to the traces depends on a

number of factors, including the trace width, dielectric material from which the circuit board is

made, and proximity to ground and power planes.

CHAPTER 3

RECOMMENDED LAYOUT PRACTICES

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Quatech 802.11B/G Especificaciones Pagina 33