Quatech 802.11B/G Especificaciones descargar pdf (Pagina 34)

3 – Recommended Layout Practices

Page 28 Airborne Wireless LAN Node Module Data Book 100-8004-102G

Quatech, Inc. Confidential

inch [mm]

1.17 [29.7]

0.83 [21.1]

1.60 [40.6]

0.17 [4.3]

1.26 [32.0]

0.004[0.1]

0.17 [4.3]

0.41[10.5]

3XØ0.09 [Ø2.2]

THIS AREA CLEAR

FROM INTERCONNECT

AND COMPONENTS

Figure 8. Guidelines for Mounting the Airborne WLN Module

3.4 EMI / RFI GUIDELINES

To minimize electromagnetic interference (EMI) and radio-frequency interference (RFI), pay

strict attention to power and signal routing near the Module. As much as possible, the keep-

clear area below the Module should be a solid copper ground plane. It is anticipated that the

Module will be mounted on a board with a committed ground plane. Ensure that the interconnect

has a designed impedance of 50-75 Ohms.

To keep signal impedance as low as possible, connect the ground plane to internal ground

planes by several vias. Ground signals to the Module connector should connect directly to the

ground plane below the Module. Individual ground connections to the Module should have a

solid ground connection, preferably directly to the ground plane on the same surface side where

the Module resides. Do not connect ground pins directly to an inside layer ground plane using

vias.

Keep interconnects from the Module connector as short as possible on the mounting layer.

All inboard signals must immediately transition to a different routing layer using a via as close to

the connector as possible. Outboard signals (odd pin numbers) should also be kept to a

minimum length.

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Quatech 802.11B/G Especificaciones Pagina 34